NXP Connects 2019

Hyatt Regency Santa Clara and Convention Center
Santa Clara, CA
Booth #509

Wednesday, June 12 | 9:00 AM – 6:00 PM
Thursday, June 13 | 9:00 AM – 5:20 PM


Designing at the Edge from IoT to Automotive

The annual, two-day, NXP Connects is a flagship event bringing together in-depth technical sessions, live demonstrations and networking opportunities featuring the latest ideas, trends, and product innovations of embedded technology.

Win a chance to take home a Western Digital backpack* after checking out a live performance demo of the i.MX8 with Western Digital’s iNAND AT EM132 automotive embedded flash drive at our booth.

* actual product may vary based on availability, subject to terms and conditions.

Schedule a Meeting

We’re ready to meet at this event and our team is ready to connect with you. Fill out the form below and our coordinator will get you on the schedule.

Field cannot be empty.
Field cannot be empty.
Field cannot be empty.
Enter a valid email address.
Field cannot be empty.
Field cannot be empty.

By clicking the "Contact Me" button below, I agree to Western Digital's Privacy Statement and authorize Western Digital and its selected partners to use my personal data in order to get updated information on Western Digital products, services, promotions, news, surveys and events from the marketing and sales organizations. I understand I can withdraw my consent at any time.

This form is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

White Paper

Utilizing advanced features for your automotive and surveillance applications. The strengths of flash storage are clear: small, fast and reliable under the most demanding of environmental conditions. But what about the challenges of data integrity and data security, especially for critical automotive and surveillance applications? Fortunately, there is an answer that addresses these issues. The implementation of the proprietary Flash Health Monitor and Host Lock provide OEMs with the data integrity and data security needed to meet the demands of an increasingly connected world.

Understanding 3D NAND Technology and Its Future Challenges. Western Digital’s 3D NAND technology (BiCS) marked important milestones in 2017 with the announcement of BICS3 64 layer based SSD, Embedded and Retail products, introduction of Four bit per cell (X4) SSD, and sampling of BICS4 96 layer 4th generation die, positioning WDC as an industry leader by realizing the cost, performance, power and reliability promise of 3D NAND technology.

Featured articles from our blog

{{getMergeArray(feed.title, '')}}

{{getEllipsis(getUnEscapedHTMLContent(getMergeArray(feed.description)), 180)}}

Read More