NXP Connects 2019

Hyatt Regency Santa Clara and Convention Center
Santa Clara, CA
Booth #509

Wednesday, June 12 | 9:00 AM – 6:00 PM
Thursday, June 13 | 9:00 AM – 5:20 PM

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ABOUT THE EVENT

Designing at the Edge from IoT to Automotive


The annual, two-day, NXP Connects is a flagship event bringing together in-depth technical sessions, live demonstrations and networking opportunities featuring the latest ideas, trends, and product innovations of embedded technology.

Win a chance to take home a Western Digital backpack* after checking out a live performance demo of the i.MX8 with Western Digital’s iNAND AT EM132 automotive embedded flash drive at our booth.

* actual product may vary based on availability, subject to terms and conditions.

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White Paper

Utilizing advanced features for your automotive and surveillance applications. The strengths of flash storage are clear: small, fast and reliable under the most demanding of environmental conditions. But what about the challenges of data integrity and data security, especially for critical automotive and surveillance applications? Fortunately, there is an answer that addresses these issues. The implementation of the proprietary Flash Health Monitor and Host Lock provide OEMs with the data integrity and data security needed to meet the demands of an increasingly connected world.

Understanding 3D NAND Technology and Its Future Challenges. Western Digital’s 3D NAND technology (BiCS) marked important milestones in 2017 with the announcement of BICS3 64 layer based SSD, Embedded and Retail products, introduction of Four bit per cell (X4) SSD, and sampling of BICS4 96 layer 4th generation die, positioning WDC as an industry leader by realizing the cost, performance, power and reliability promise of 3D NAND technology.

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